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Industry-first chip form diode realized by the most state-of-the-art packaging technology in the world.
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Product types including Schottky, GPRC rectifier, and TVS. |
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Comparison of SMD Diode(1) |
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| ‧Traditional SOD-323 (by wire bonding) |
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‧To get more current density
‧To get better thermal dissipation
‧To get better surge capability
‧To be more robust |
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| ‧Zowie MSCD series ( 0805 size, footprint equivalent to traditional SOD-323) |
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Comparison of SMD Diode(2)-Halogen Free |
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‧Multilayer FR-5 substrate
‧Higher current density capability(same rating but smaller in size)
‧Leadless chip forming construction
‧No wire bonding
‧High thermal dissipation |
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Mini Bridge Rectifier
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SuperChip ( Chip Form Diode) |
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SuperChip ( Chip Form Diode) |
| NO. |
Products |
| 0402 |
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| 0603 |
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| 0805 |
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| 1206 |
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| 2010 |
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| 2114 |
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| 3220 |
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SuperChip – Product Table |
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SuperChip – Product Table |
Products
Series
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Size |
Schottky |
Rectifier(**) |
Tvc(***) |
| EIAJ |
JEDEC |
0.1A |
0.2A |
0.3A |
0.5A |
1A |
2A |
3A |
5A |
1A |
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| VSCD |
0402 |
SOD-723 |
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| USCD |
0603 |
SOD-523 |
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| MSCD |
0805 |
SOD-323 |
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| SSCD |
1206 |
SOD-123 |
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| BYD |
1206 |
SOD-123 |
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| SCD |
2010 |
SMA[DO-214AC] |
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| BSCD |
2114 |
SMB[DO-214AA] |
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| CSCD |
3220 |
SMC[DO-214AB] |
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| BTCD |
2114 |
SMB[DO-214AA] |
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| CTCD |
3220 |
SMC[DO-214AB] |
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