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Vision
To be a world leading supplier of encapsulation & packaging technologiesfor diodes and discrete components.


 
   
Mission
Customer satisfaction through innovated technology, quality,
service and competitive cost.


 
   
Background
‧Founded by Dr. D. H. Hu and Mr. George Dai in June,1994.
‧Company goal is to innovate the new generation technologies (GPRC / SRII / SuperChip) for diodes and discrete semiconductors to satisfy the requirements of customers.
 
   
   
   
   
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