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Vision
To be a world leading supplier of encapsulation & packaging technologiesfor diodes and discrete components.
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Mission
Customer satisfaction through innovated technology, quality,
service and competitive cost.
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Background
‧Founded by Dr. D. H. Hu and Mr. George Dai in June,1994.
‧Company goal is to innovate the new generation technologies (GPRC / SRII / SuperChip) for diodes and discrete semiconductors to satisfy the requirements of customers.
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