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原材料變更相關資料

 
 Component Structure Drawings
Homogeneous material Type name
Homogeneous material Vender
Chemical Element substance name
Chemical Element substance Weight Percentage(wt%)
變更前
FRP
IT-140G
ITEQ Corporation (Taiwan)
Cured of phosphorsbisphenol-A Resin& filler
23.97%
Bisphenol A- Resin
6.00%
Amine catalyst
0.03%
Acetone
0.50%
Glass Fabric
39.50%
Copper Foil Note 2
30.00%
FRP
NPG-TL
NAN YA Plastics Corporation
E-Glass Fabric
30~60%
Copper Foil
10~30%
Epoxy Resin
30~60%
Filler
10~30%
變更後
FRP
DE156
ISOLA USA Corporation
Countinuous filament glass fibers
43.00%
Copper Foil
14.00%
Non-Hazardous Cured Resin
43.00%
Position
 Component Structure Drawings
Homogeneous material Type name
Homogeneous material Vender
Chemical Element substance name
Chemical Element substance Weight Percentage(wt%)
變更前
Solder Cream
WS609
Alpha Metals Taiwan Inc.
Sn
96.00%
Ag
3.50%
Cu
0.50%
Solder Cream
SN96CI
Nihon Superior Co., Ltd
Sn
96.00%
Ag
3.50%
Cu
0.50%
變更後
Solder Cream *註
INDALLOY 228 with NC-SMQ 75
Indium Corporation
Sn
10%
Pb
88%
Ag
2%

*註:符合RoHS排外條款項目7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead);用於零部件、設備連接之高熔點銲錫材料(鉛含量85 wt%以上之鉛基合金)
   
   
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