Fully glass passivated rectifier chip implemented by Zowie
proprietary technology.
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Chip types ranging from general rectifiers,fast recovery
rectifiers to ultrafast recovery rectifiers.
Rectifier Diode with GPRC TM Inside ( SUPEREX II TM )
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Packaged diode products with GPRCTM chip inside.
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Package types including SMD, axial lead, bridge, andpower packages.
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Diode Structure (1)
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Diode Structure (2)
‧Zowie GPRC(P-N junction fully glass passivated)
‧Traditional GPP(P-N junction not fully passivated)
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SRIITM ( Rectifier Diode with GPRCTM Inside)
Chip Form Diode ( SuperChip TM )
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Industry-first chip form diode realized by the most state-of-the-art packaging technology in the world.
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Product types including Schottky, GPRC rectifier, and TVS.
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Comparison of SMD Diode(1)
‧Traditional SOD-323 (by wire bonding)
‧To get more current density
‧To get better thermal dissipation
‧To get better surge capability
‧To be more robust
‧Zowie MSCD series ( 0805 size, footprint equivalent to traditional SOD-323)
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Comparison of SMD Diode(2)-Halogen Free
‧Multilayer FR-5 substrate
‧Higher current density capability(same rating but smaller in size)
‧Leadless chip forming construction
‧No wire bonding
‧Lead-free solder joint
‧High thermal dissipation
